USB Charger PCB Board and Mobile Power PCB Board Assembly Service

• Customization: Available
• Dielectric: FR-4
• Material: Fiberglass Epoxy
• Model NO.: mobile power pcb board
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Base Material: Copper
• Insulation Materials: Organic Resin
• Model No.: Mobile Power PCB
• Copper Thickness: 1-20oz
• Solder Mask: Green/Black/White/Blue/Yellow/Red
• Surface Finish: HASL+Lf/ Immersion Gold/Tin/Silver/ Plating Gold
• Certificate: Ts16949,,UL, RoHS, SGS, ISO9001 ISO14000
• Shipping: DHL, UPS, TNT, FedEx, etc
• Transport Package: by Vacuum Packing in Cartons
• Origin: Shenzhen
• HS Code: 85340090
• Production Capacity: 50000PCS/Year

Product Description

Welcome to Keep Moving Circuits Co., Ltd 

KEEP  MOVING  CIRCUITS  CO., LTD was founded in August, 2000 a hi-tech enterprise, specializes in manufacture ,supply and export of high precision 1 layer ,2layer and multilayer PCB. Since Jan.2011,the core business are  Multilayer(including HDI) middle up to high volume PCB orders ,High Frenquency and Metal Core PCB orders . For offering all customers better service , we can offer flexible  PCB  and rigid-flexible PCB and PCBA service . Through the hard work and dedication of all employees during the past years, we are already one  excellent PCB manufacturer in China. Our company covers  over 30000 square meters modernized workshop area and a complete set of advanced production equipment ,with about 1000 fixed employees and more than 300 of senior management ,craftsmen and engineers., a group of quality talents with over ten years of experience in PCB industry. We warmly welcome your visit and cooperation.

Product Description
Quick lead time PCBA with high quality
RoHS complaint PCB
Lead free/Immersion Gold/Silver/Tin technology
UL approved

Our Capacit

PCB Assembly Capability
Order Quantity	1-50,000pcs(including prototype)
Components	SMD and THT From size 0402.0201 to 01005 SOIC,PLCC,TSOP,QFP,BGA
Assembly Method	Single and double-sided/SMD and THT/SMT and Thru-hole
Ball Grid Array(BGA)	As small as 0.5mm pitch All BGA placements are inspected by X-Ray
Components Package	Poles,Reels,Tape Strips,Bulk Supply
Maximum Componentsize	55*55*15mm Fine Pitch from 0.4mm Minimum Pin width 0.2mm
Solder	Lead free and conforming to DIN 32513,ISO,EN29454,IPC 650
Related Test	Aol & X-Ray Inspection,Flying Probe Test and in Circuit Test
File Format	BOM & Gerber files

Our service

Inquiry	1. Please send the BOM list and PCB Gerber files to us for detail quotation
	2. If you need to design, please provide us the schematic, functions of product, size etc. Sample and Picture would be better.
Quotation	1. Engineer confirms PCB requirements and Purchasing department confirms components.
	2. Quotation will be offered within 3 working days.
Payment	Regarding payment term: T/T, L/C.
Sample making	Few samples will be produced before full production; All steps are strictly performed by company control and quality control.
Mass Production	After sample confirmed discussion about packing, shipping. Production department start the order schedule.

Our quality