4 Layer PCB Board Immersion Gold Lead-Free Circuit Board
US$0.05 - 0.10 | 5 Pieces (MOQ) |
Port:
Shenzhen, China
Production Capacity:
100000PCS/Year
Payment Terms:
L/C, T/T, D/P, Western Union, Paypal, Money Gram
Keep Moving Circuits Co., Ltd.
Guangdong, China
Last Login Date:
Jul 26, 2025
Main Products:
PCBA, PCB+Assembly, FPC, Flexible PCB, Long FPC, FPC Assembly, Rigid-Flex PCB, Multilayer PCB, High Frequency PCB, Alunimium PCB
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Product Description
Company Info
Basic Info.
Type
Rigid Circuit Board
Dielectric
FR-4
Material
Fiberglass Epoxy
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Base Material
Copper
Insulation Materials
Organic Resin
Min. Hole Size
0.2mm
Min. Line Width&Spacing
0.1mm/0.1mm
Solder Mask Color
Green/Black/White/Blue/Yellow/Red
Certificates
UL, RoHS, SGS, ISO9001 ISO14000
Shipping
DHL, UPS, TNT, FedEx, etc
Transport Package
by Vacuum Packing in Cartons
Origin
Shenzhen
HS Code
85340090
Product Description
Product Description
Quick lead time PCBA with high quality
RoHS complaint PCB
Lead free/Immersion Gold/Silver/Tin technology
UL approved
Our CapacitNo | Items | Production Capability |
1 | PCB Counts | 1 ~ 50 layers |
2 | Material Type | FR4,High TG , CEM1,CEM3,PTFE,Aluminum Base,Arlon,Rogers,Halogen free |
3 | Maximum Panel Size | 500mmx1200mm |
4 | Board Outline Tolerance | Routing:±0.13mm ;Punching:±0.05mm |
5 | Finished Board Thickness | 0.20mm--6.00mm |
6 | Finshed Board Thickness Tolerance | >=0.8mm : ±8% ; <0.8mm: ±10% |
7 | Minimum Trace Width/Space | 0.003" /0.003" |
8 | Finished Outer Copper Thickness | 1OZ---5OZ |
9 | Finshed Inner Cooper Thickness | 0.50OZ--5OZ |
10 | Finished Hole Size | 0.10mm--6.30mm |
11 | Hole Size Tolerance | NPTH: ±0.05mm ; PTH: ±0.076mm |
12 | Hole Location Registration(Mechanical) | ±0.08mm |
13 | Aspect Ratio | 13:01 |
14 | Solder Mask Type | LPI |
15 | SMT Mini.Solder Mask Width | 0.08mm |
16 | Plug Via Diameter | 0.25mm--0.60mm |
17 | Impedance Control Tolerance | ±5% |
18 | Surface Treatment Type | HASL;HASL+Lead Free;Immersion Gold;Immersion Tin;Flash Gold; OSP;Immersion Silver;Gold Finger;Carbon Ink;Peelable Mask |
Feature | Laser via PCB capability | ||||||
Mass production | Sample Run(Small Value) | ||||||
(Normal lower cost) | (High Value normal) | (High Value higher cost) | |||||
Line /space width (trace layers) | .005"/.005" | .004"/.004" | .003"/.003" | .0025" | |||
Line /space width (HDI layers) | .005"/.005" | .004"/.004" | .003"/.003" | .0025" | |||
Drill via size (PTH) | .010" | .010" | .010" | .008" | |||
Drill capture pad (PTH) | .022" | .020" | .018" | .016" | |||
Micro via size (unfinished) | RCC | .004" | .004" | .004" | . 003" | ||
Micro capture pad | .014" | .012" | .011" | .009" | |||
Micro via size (unfinished) | PP | .005" | .004" | .004" | .003" | ||
Micro capture pad | .014" | .012" | .011" | .010" | |||
Aspect ratio (PTH) | 8:01 | 9:01 | 10:01 | 11:01 | |||
Aspect ratio (Micro via) | 0.6:1 | 0.8:1 | 0.9:1 | 1:01 | |||
Layer to layer Registration | ±5mil | ±4mil | ±3mil | ±2mil | |||
Impedance control | ±10%(±5Ω) | ±10%(±4Ω | ±7%(±3Ω) | ±5%(±2.5Ω) |
Our service
Feature | Laser via PCB capability | ||||||
Mass production | Sample Run(Small Value) | ||||||
(Normal lower cost) | (High Value normal) | (High Value higher cost) | |||||
Line /space width (trace layers) | .005"/.005" | .004"/.004" | .003"/.003" | .0025" | |||
Line /space width (HDI layers) | .005"/.005" | .004"/.004" | .003"/.003" | .0025" | |||
Drill via size (PTH) | .010" | .010" | .010" | .008" | |||
Drill capture pad (PTH) | .022" | .020" | .018" | .016" | |||
Micro via size (unfinished) | RCC | .004" | .004" | .004" | . 003" | ||
Micro capture pad | .014" | .012" | .011" | .009" | |||
Micro via size (unfinished) | PP | .005" | .004" | .004" | .003" | ||
Micro capture pad | .014" | .012" | .011" | .010" | |||
Aspect ratio (PTH) | 8:01 | 9:01 | 10:01 | 11:01 | |||
Aspect ratio (Micro via) | 0.6:1 | 0.8:1 | 0.9:1 | 1:01 | |||
Layer to layer Registration | ±5mil | ±4mil | ±3mil | ±2mil | |||
Impedance control | ±10%(±5Ω) | ±10%(±4Ω | ±7%(±3Ω) | ±5%(±2.5Ω) |
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