Customization: | Available |
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Metal Coating: | Gold |
Mode of Production: | SMT |
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Layers | 1-30 layers |
Min Board Thickness(2-layer) | 0.2mm |
Max Board Size | 635 × 1100mm | Min Board Thickness(4-layer) | 0.6mm |
Min Board Size | 20 × 30mm | Min Inner-layer Thickness | 0.1mm |
Min Trace | 0.1mm | Min Annular Ring | 0.1mm |
Min Space | 0.1mm | Min Hole Location Tolerance | ±0.075mm |
Min Hole Size | 0.2mm | Min Hole Size Tolerance | ±0.05mm |
Board Warp | ≤ 1° | Min Outer Dimension Tolerance | ±0.1mm |
Solder Mask | Green, Yellow, Red, Black, Blue, White | ||
Surface Finish | HAL, HASL, Immersion Gold, Immersion Silver, Plating Gold, Plating Nickel, Plating Silver, Gold Finger, OSP | ||
Board Material | FR-4, High Tg FR-4, Halogen Free FR-4, Thick Copper FR-4, Aluminium Based, Rogers, Taconic | ||
Acceptable file | Gerber file(RS-274-X or RS-274-D with aperture list and drill files),Protel,PADS,POWERPCB,AutoCAD,ORCAD | ||
CAM software | Genesis, CAM350 |
Available Services PCB Manufacturing PCB Assembly Components Sourcing SMT Stencils Cable Assembly PCBA Testing Final Product Assembly |
Assembly Technologces SMT THT Reflow Soldering Wave Soldering Hand Soldering Repair/Rework Mixed Assembly Technologies |