4 Layer PCB Board Immersion Gold Lead-Free Circuit Board

• Type: Rigid Circuit Board
• Dielectric: FR-4
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Base Material: Copper
• Insulation Materials: Organic Resin
• Min. Hole Size: 0.2mm
• Min. Line Width&Spacing: 0.1mm/0.1mm
• Solder Mask Color: Green/Black/White/Blue/Yellow/Red
• Certificates: UL, RoHS, SGS, ISO9001 ISO14000
• Shipping: DHL, UPS, TNT, FedEx, etc
• Transport Package: by Vacuum Packing in Cartons
• Origin: Shenzhen
• HS Code: 85340090
• Production Capacity: 100000PCS/Year

Product Description

Product Description
Quick lead time PCBA with high quality
RoHS complaint PCB
Lead free/Immersion Gold/Silver/Tin technology
UL approved

Our Capacit

No	Items	Production Capability
1	PCB Counts	1 ~ 50 layers
2	Material Type	FR4,High TG , CEM1,CEM3,PTFE,Aluminum Base,Arlon,Rogers,Halogen free
3	Maximum Panel Size	500mmx1200mm
4	Board Outline Tolerance	Routing:±0.13mm  ;Punching:±0.05mm
5	Finished Board Thickness	0.20mm--6.00mm
6	Finshed Board Thickness Tolerance	>=0.8mm :     ±8%  ; <0.8mm:       ±10%
7	Minimum Trace Width/Space	0.003" /0.003"
8	Finished Outer Copper Thickness	1OZ---5OZ
9	Finshed Inner Cooper Thickness	0.50OZ--5OZ
10	Finished Hole Size	0.10mm--6.30mm
11	Hole Size Tolerance	NPTH: ±0.05mm  ; PTH: ±0.076mm
12	Hole Location Registration(Mechanical)	±0.08mm
13	Aspect Ratio	13:01
14	Solder Mask Type	LPI
15	SMT Mini.Solder Mask Width	0.08mm
16	Plug Via Diameter	0.25mm--0.60mm
17	Impedance Control Tolerance	±5%
18	Surface Treatment Type	HASL;HASL+Lead Free;Immersion Gold;Immersion Tin;Flash Gold;                        OSP;Immersion Silver;Gold Finger;Carbon Ink;Peelable Mask

 

Feature		Laser via PCB capability
		Mass production			Sample Run(Small Value)
		(Normal lower cost)	(High Value normal)	(High Value higher cost)
Line /space width (trace layers)		.005"/.005"	.004"/.004"	.003"/.003"	.0025"
Line /space width (HDI layers)		.005"/.005"	.004"/.004"	.003"/.003"	.0025"
Drill via size (PTH)		.010"	.010"	.010"	.008"
Drill capture pad (PTH)		.022"	.020"	.018"	.016"
Micro via size (unfinished)	RCC	.004"	.004"	.004"	. 003"
Micro capture pad		.014"	.012"	.011"	.009"
Micro via size (unfinished)	PP	.005"	.004"	.004"	.003"
Micro capture pad		.014"	.012"	.011"	.010"
Aspect ratio (PTH)		8:01	9:01	10:01	11:01
Aspect ratio (Micro via)		0.6:1	0.8:1	0.9:1	1:01
Layer to layer Registration		±5mil	±4mil	±3mil	±2mil
Impedance control		±10%(±5Ω)	±10%(±4Ω	±7%(±3Ω)	±5%(±2.5Ω)

Our service

Feature		Laser via PCB capability
		Mass production			Sample Run(Small Value)
		(Normal lower cost)	(High Value normal)	(High Value higher cost)
Line /space width (trace layers)		.005"/.005"	.004"/.004"	.003"/.003"	.0025"
Line /space width (HDI layers)		.005"/.005"	.004"/.004"	.003"/.003"	.0025"
Drill via size (PTH)		.010"	.010"	.010"	.008"
Drill capture pad (PTH)		.022"	.020"	.018"	.016"
Micro via size (unfinished)	RCC	.004"	.004"	.004"	. 003"
Micro capture pad		.014"	.012"	.011"	.009"
Micro via size (unfinished)	PP	.005"	.004"	.004"	.003"
Micro capture pad		.014"	.012"	.011"	.010"
Aspect ratio (PTH)		8:01	9:01	10:01	11:01
Aspect ratio (Micro via)		0.6:1	0.8:1	0.9:1	1:01
Layer to layer Registration		±5mil	±4mil	±3mil	±2mil
Impedance control		±10%(±5Ω)	±10%(±4Ω	±7%(±3Ω)	±5%(±2.5Ω)

our company